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| High Temperature Forward & Reverse
Bias Test (HTFB / HTRB) |
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This test is an indicator of long term
operating reliability and junction stability. That leakage current
is monitored under heating and voltage applied during the time.
Thyristors have an off-state forward and reverse bias leakage
currents, which increase in magnitude when increasing temperature,
time and prolonged voltage. Moreover, when a decrease in the
leakage current drift is observed, it should be understood as
a device stabilization. The highest the leakage current is,
the shorter the lifetime in a circuit.
Leakage current drifts after 1000 hours in forward and reverse
mode are analysed. |
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| Intermittent
Operating Life Test (IOL) |
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Also known as power cycling test, devices
are subjected to power to maximum rated on-state current -I(RMS),
until they reach the maximum junction temperature (Tj max.).
Then, the devices are powered down and cooled to near room temperature.
This cycle is repeated 10,000 times.
This test is important to determine the integrity of the chip,
metallization and lead frame assembly. Devices subjected to
intermittent operating life are stressed and this thermal fatigue
can originate failures by contact degradation. |
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| High Temperature Storage Life Test
(HTS) |
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In this test the devices are placed
and stored at high temperature. Heat alone can activate mobile
ions that are present in, or on, the package of the chip, which
can cause variations in the electrical parameters with time.
The purpose of this test is to accelerate any failure mechanism
that could happen during long periods of time at normal storage
temperatures.
Devices are tested at different times to observe eventual drifts.
|
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| Thermal Cycling Test (TC) |
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Contractions and expansions of the
chip and the package could damage the device and cause catastrophic
failures. Therefore, special attention must be put in the matching
of the expansion coefficients of the materials that make up
the device.
This test tries to find out physical dislocations of device's
materials under extreme temperatures. |
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| Pressure Cooker Test (PCT) |
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The water vapour, under pressure, stresses
the resistance to moisture to find out those failures connected
with the plastic package.
It is checked how hermetic the plastic body is and the quality
of the epoxy moulding compound to preserve the internal electrical
contacts of devices of any corrosion growth. |
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| Solderability & Moisture Sensitive
Level |
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Fagor Electronica, S. Coop's components
fulfil the JEDEC standards JESD22-B102D about Solderability
and JSTD - 020C about Moisture Sensitive classification of SMD's
components:
> Moisture Sensitive Level: 1 according to JSTD - 020C
> Reflow soldering profile recommended: According to table
5 - 2 of JSTD - 020C.
> Preconditions for Solderability testing: 150ºC, dry bake,
16 hours according to JESD22 - B102D. |
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